Application for semiconductor assembly product by ultrasonic
碩士 === 國立高雄應用科技大學 === 電子工程系 === 97 === In early periods the electronic assembly product evolution is improved from PDIP、QFP、BGA to FCBGA and CSP. In manufacture production to ensure process variation could be detect and control immediately some of destructive/non-destructive inspection/test/measurem...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/81516412698144100748 |