| Summary: | 碩士 === 義守大學 === 機械與自動化工程學系碩士班 === 97 === Plasma surface treatments have been widely used in standard IC packaging processes, and indicate no electric and mechanical properties damages on the treated substrates. The study mainly investigate the surface characteristics variations of plastic ball grid array (PBGA) and film ball grid array (Film BGA) packaging substrates by atmospheric pressure (AP) plasma system.
Low temperature AP system which contains priorities of low cost, high throughput, more environmental protection, widely used in various geometrical substrates, in-line process capabilities has resulted in the promising next-generation candidate system for replacing traditional thermal, low-pressure plasma or wet chemical processes in the future.
AP plasma jet system has uniform discharge phenomena under atmospheric pressure, and gives a lot of positive impacts on the treated material surface. Epoxy resins and polyimides with reasonable physical and mechanical properties have been widely fabricated to PBGA and Film BGA packaging substrates, respectively. Plasma surface modification may produce the active functional groups to help the adhesion process of these packaging substrates.
The AP plasma effects on the packaging substrates and optimal processing parameters are determined by contact angles, surface morphology, surface roughness and functional groups variations analysis.
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