Study of Atmospheric Pressure Plasma Surface Treatment for PBGA and Film BGA Packaging Substrates
碩士 === 義守大學 === 機械與自動化工程學系碩士班 === 97 === Plasma surface treatments have been widely used in standard IC packaging processes, and indicate no electric and mechanical properties damages on the treated substrates. The study mainly investigate the surface characteristics variations of plastic ball grid...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/72744390712833092029 |