The Study on The Mark Deviation of Probe Needle During Wafer Test
碩士 === 義守大學 === 材料科學與工程學系碩士班 === 97 === In wafer test process, the overkill caused by abnormal processing condition, and wastes both machine efficiency and man power. Hence, the main and pressing mission of wafer test is to figure out corresponding prevention from test. This study focuses on analyzi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/97145105303988420894 |