The Sag Problem of Wire Bond in Multi-Chip and 3-Dimensional Semiconductor Packages
碩士 === 正修科技大學 === 機電工程研究所 === 97 === To integrate numerous complex functions, chip modules have gradually expanded into a more advanced Multi-Chip Module (MCM) and/or 3-Dimension Module. Compared to the single chip design, the development period is shorter and the cost is less when the Multi-Chip Mo...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/74174979322958491566 |