Thermal and Optical Analyses and Measurements of Multi-chip LED Package
碩士 === 長庚大學 === 機械工程研究所 === 97 === The purpose of this study is to investigate the thermal behaviors and candela distributions of multi-chip LED package. This package contains three kinds of LEDs colors (red, green and blue chips), which can be combined to generate colored and white light. In experi...
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| Format: | Others |
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2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/41589017205958552700 |