Silicon Die Strength Tests with Ball-Applied Loading: Evaluation and Improvement
碩士 === 長庚大學 === 機械工程研究所 === 97 === In the application of 3-D packages or stacked die packages, most of the silicon wafers have to be ground thinner, and then the strength data of the dies cut from the wafers are needed for further assuring good design and reliability of the packages. For determining...
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| Format: | Others |
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2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/01031270276000484280 |