Study of High-k Materials as Trapping Layer Combined with Rapid Thermal Annealing for Nonvolatile Memory Application

碩士 === 長庚大學 === 電子工程學研究所 === 97 === In this paper, we use high-k dielectric material as flash memory charge trapping layer. The high dielectric coefficient material, Titanium and Hafnium intermix with Titanium and Tantalum using sputtering to form metal oxide charge trapping layer. Meanwhile, we dis...

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Main Authors: Chuang Chih Sheng, 莊志勝
Other Authors: C. H. Kao
Format: Others
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/75192360131549330508
id ndltd-TW-097CGU05428008
record_format oai_dc
spelling ndltd-TW-097CGU054280082015-10-13T12:04:55Z http://ndltd.ncl.edu.tw/handle/75192360131549330508 Study of High-k Materials as Trapping Layer Combined with Rapid Thermal Annealing for Nonvolatile Memory Application 使用高介電材料之電荷補陷層結合快速熱退火於非揮發性記憶體之研究 Chuang Chih Sheng 莊志勝 碩士 長庚大學 電子工程學研究所 97 In this paper, we use high-k dielectric material as flash memory charge trapping layer. The high dielectric coefficient material, Titanium and Hafnium intermix with Titanium and Tantalum using sputtering to form metal oxide charge trapping layer. Meanwhile, we discuss these three kinds of metal with high dielectric coefficient as charge-trapping layer. To compare with their physical and electrical property, these three kinds of devices are composed by tunneling oxide (silicon dioxide) – charge trapping layer – control oxide (silicon dioxide) with same thicknesses (3nm, 12nm, 10nm, respectively). Through different RTA process, the memory window of Titanium nonvolatile memory are larger than Hafnium intermix with Titanium and Tantalum, but window of Titanium and Tantalum nonvolatile memory will shrink while annealing temperature arises. And the memory window of Hafnium intermix with Titanium nonvolatile memory device will increase with annealing temperature arise. According to experiment, Hafnium intermix with Titanium nonvolatile memory device obtain better thermal stability. Among these three kinds of memory, Titanium and Hafnium intermix with Titanium program speed can be at 1ms, and erase speed is about 3~5s, the erase speed of Titanium nonvolatile flash memory is quicker than Titanium and Hafnium intermix, and the program speed of Tantalum nonvolatile flash memory can up to 1ms, and erase speed is about 3s. Tantalum nonvolatile flash memory obtain better retention time than Hafnium intermix with Titanium and Tantalum nonvolatile flash memory at both room temperature and 85ºC. And charge-loss rate of Tantalum nonvolatile flash memory are less than Hafnium intermix with Titanium and Tantalum nonvolatile flash memory. The experiment results proved that no matter Tantalum nonvolatile flash memory, Hafnium intermix with Titanium or Tantalum nonvolatile flash memory, they all have better retention storage property. C. H. Kao 高泉豪 2009 學位論文 ; thesis 144
collection NDLTD
format Others
sources NDLTD
description 碩士 === 長庚大學 === 電子工程學研究所 === 97 === In this paper, we use high-k dielectric material as flash memory charge trapping layer. The high dielectric coefficient material, Titanium and Hafnium intermix with Titanium and Tantalum using sputtering to form metal oxide charge trapping layer. Meanwhile, we discuss these three kinds of metal with high dielectric coefficient as charge-trapping layer. To compare with their physical and electrical property, these three kinds of devices are composed by tunneling oxide (silicon dioxide) – charge trapping layer – control oxide (silicon dioxide) with same thicknesses (3nm, 12nm, 10nm, respectively). Through different RTA process, the memory window of Titanium nonvolatile memory are larger than Hafnium intermix with Titanium and Tantalum, but window of Titanium and Tantalum nonvolatile memory will shrink while annealing temperature arises. And the memory window of Hafnium intermix with Titanium nonvolatile memory device will increase with annealing temperature arise. According to experiment, Hafnium intermix with Titanium nonvolatile memory device obtain better thermal stability. Among these three kinds of memory, Titanium and Hafnium intermix with Titanium program speed can be at 1ms, and erase speed is about 3~5s, the erase speed of Titanium nonvolatile flash memory is quicker than Titanium and Hafnium intermix, and the program speed of Tantalum nonvolatile flash memory can up to 1ms, and erase speed is about 3s. Tantalum nonvolatile flash memory obtain better retention time than Hafnium intermix with Titanium and Tantalum nonvolatile flash memory at both room temperature and 85ºC. And charge-loss rate of Tantalum nonvolatile flash memory are less than Hafnium intermix with Titanium and Tantalum nonvolatile flash memory. The experiment results proved that no matter Tantalum nonvolatile flash memory, Hafnium intermix with Titanium or Tantalum nonvolatile flash memory, they all have better retention storage property.
author2 C. H. Kao
author_facet C. H. Kao
Chuang Chih Sheng
莊志勝
author Chuang Chih Sheng
莊志勝
spellingShingle Chuang Chih Sheng
莊志勝
Study of High-k Materials as Trapping Layer Combined with Rapid Thermal Annealing for Nonvolatile Memory Application
author_sort Chuang Chih Sheng
title Study of High-k Materials as Trapping Layer Combined with Rapid Thermal Annealing for Nonvolatile Memory Application
title_short Study of High-k Materials as Trapping Layer Combined with Rapid Thermal Annealing for Nonvolatile Memory Application
title_full Study of High-k Materials as Trapping Layer Combined with Rapid Thermal Annealing for Nonvolatile Memory Application
title_fullStr Study of High-k Materials as Trapping Layer Combined with Rapid Thermal Annealing for Nonvolatile Memory Application
title_full_unstemmed Study of High-k Materials as Trapping Layer Combined with Rapid Thermal Annealing for Nonvolatile Memory Application
title_sort study of high-k materials as trapping layer combined with rapid thermal annealing for nonvolatile memory application
publishDate 2009
url http://ndltd.ncl.edu.tw/handle/75192360131549330508
work_keys_str_mv AT chuangchihsheng studyofhighkmaterialsastrappinglayercombinedwithrapidthermalannealingfornonvolatilememoryapplication
AT zhuāngzhìshèng studyofhighkmaterialsastrappinglayercombinedwithrapidthermalannealingfornonvolatilememoryapplication
AT chuangchihsheng shǐyònggāojièdiàncáiliàozhīdiànhébǔxiàncéngjiéhékuàisùrètuìhuǒyúfēihuīfāxìngjìyìtǐzhīyánjiū
AT zhuāngzhìshèng shǐyònggāojièdiàncáiliàozhīdiànhébǔxiàncéngjiéhékuàisùrètuìhuǒyúfēihuīfāxìngjìyìtǐzhīyánjiū
_version_ 1716852459138187264