The Effect of Pulse-Reverse Plating Operation Parameters on The Electro-Plating Performance of The Blind Micro Via and Through Hole Filling
碩士 === 長庚大學 === 化工與材料工程研究所 === 97 === An advanced horizontal pulse-reverse plating system was employed to study the operation parameters i.e. concentration of ferric ion, electrolyte pumping frequency (pumping rate), and reverse plating time on the copper-plating performance of via in the PCB (plate...
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| Format: | Others |
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2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/35340255881761431092 |