Temperature Adjustment and Failure Detection circuits

碩士 === 國立中正大學 === 電機工程所 === 97 === As the evolution of semiconductor proceeds, MOSFETs gate oxide thickness and dimensions of scale shrink in circuit design. Reliability problems occur and need to be considered early in the design step. Because temperature is the critical factor of reliability probl...

Full description

Bibliographic Details
Main Authors: Jing-Bin Huang, 黃敬斌
Other Authors: Kung-Yen Lee
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/29544789094914180535
id ndltd-TW-097CCU05442010
record_format oai_dc
spelling ndltd-TW-097CCU054420102015-11-25T04:04:40Z http://ndltd.ncl.edu.tw/handle/29544789094914180535 Temperature Adjustment and Failure Detection circuits 溫度調節與故障偵測電路 Jing-Bin Huang 黃敬斌 碩士 國立中正大學 電機工程所 97 As the evolution of semiconductor proceeds, MOSFETs gate oxide thickness and dimensions of scale shrink in circuit design. Reliability problems occur and need to be considered early in the design step. Because temperature is the critical factor of reliability problems, the main purpose of this thesis is to develop a circuit for adjusting temperature and replacing the damaged switching device. The circuit adjusts the temperature without inducing excess switching loss as main switching device overheats. In addition, when the main device is damaged, a backup device will completely take over the function of this main device, keeping the normal operation of this system. The indicator light will turn on for the purpose of replacing the damaged device. The temperature adjustment and failure detecting circuit has been built, from which experimental measurement has verified the feasibility of this proposed system. Kung-Yen Lee 李坤彥 2008 學位論文 ; thesis 55 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立中正大學 === 電機工程所 === 97 === As the evolution of semiconductor proceeds, MOSFETs gate oxide thickness and dimensions of scale shrink in circuit design. Reliability problems occur and need to be considered early in the design step. Because temperature is the critical factor of reliability problems, the main purpose of this thesis is to develop a circuit for adjusting temperature and replacing the damaged switching device. The circuit adjusts the temperature without inducing excess switching loss as main switching device overheats. In addition, when the main device is damaged, a backup device will completely take over the function of this main device, keeping the normal operation of this system. The indicator light will turn on for the purpose of replacing the damaged device. The temperature adjustment and failure detecting circuit has been built, from which experimental measurement has verified the feasibility of this proposed system.
author2 Kung-Yen Lee
author_facet Kung-Yen Lee
Jing-Bin Huang
黃敬斌
author Jing-Bin Huang
黃敬斌
spellingShingle Jing-Bin Huang
黃敬斌
Temperature Adjustment and Failure Detection circuits
author_sort Jing-Bin Huang
title Temperature Adjustment and Failure Detection circuits
title_short Temperature Adjustment and Failure Detection circuits
title_full Temperature Adjustment and Failure Detection circuits
title_fullStr Temperature Adjustment and Failure Detection circuits
title_full_unstemmed Temperature Adjustment and Failure Detection circuits
title_sort temperature adjustment and failure detection circuits
publishDate 2008
url http://ndltd.ncl.edu.tw/handle/29544789094914180535
work_keys_str_mv AT jingbinhuang temperatureadjustmentandfailuredetectioncircuits
AT huángjìngbīn temperatureadjustmentandfailuredetectioncircuits
AT jingbinhuang wēndùdiàojiéyǔgùzhàngzhēncèdiànlù
AT huángjìngbīn wēndùdiàojiéyǔgùzhàngzhēncèdiànlù
_version_ 1718136255663833088