Temperature Adjustment and Failure Detection circuits

碩士 === 國立中正大學 === 電機工程所 === 97 === As the evolution of semiconductor proceeds, MOSFETs gate oxide thickness and dimensions of scale shrink in circuit design. Reliability problems occur and need to be considered early in the design step. Because temperature is the critical factor of reliability probl...

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Bibliographic Details
Main Authors: Jing-Bin Huang, 黃敬斌
Other Authors: Kung-Yen Lee
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/29544789094914180535