Investigations of resins and molding parameters for the warpage of an electronic connector plastic housing
碩士 === 雲林科技大學 === 機械工程系碩士班 === 96 === Nowadays, without sacrificing much quality of plastic parts, industry usually applies regrind resins to the precision injection-molding processes. The purpose of the present study is to investigate differences of the rheological, thermal, and mechanical properti...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/58021613608159612826 |