The study of interfacial reaction between SnBi solder and Au substrate
碩士 === 國立臺北科技大學 === 化學工程研究所 === 96 === The interfacial reaction between Sn-Bi solder and Au substrate grows Sn-Au intermetallic compound (IMC) mainly. The constituent of IMC depends on the composition (wt%) of Bi in the solder. When the weight percent of Bi is more than eutectic composition (57wt%),...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/mbjuaq |