Fracture analysis of ITO thin films

碩士 === 聖約翰科技大學 === 自動化及機電整合研究所 === 96 ===   With outstanding performance, thin films have been widely used in broad applications. However, fracture induced in manufacture or application processes will reduce the performance of thin films. In this work, a 300 nm thinkness ITO thin films is deposited...

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Bibliographic Details
Main Authors: LIN. TZU MIN, 林子閔
Other Authors: Chang Rwie Ching
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/32801283639599813724
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Summary:碩士 === 聖約翰科技大學 === 自動化及機電整合研究所 === 96 ===   With outstanding performance, thin films have been widely used in broad applications. However, fracture induced in manufacture or application processes will reduce the performance of thin films. In this work, a 300 nm thinkness ITO thin films is deposited by a RF magnetron sputter. Nanoindentation is utilized to test the mechanical properties and fracture toughness of the thin films with various sputter powers and substates. The results show that the hardness and elastic modulus increase as the sputter power increases. The fracture toughness of ITO deposited on PET is smaller than the result on the silicon substrate, where the crack length predicted from plastic zone and indent depth increase whith the increasing sputter power. Moreover, in all cases, the surface resistances of the ITO thin films are below 10 Ω/□, and the preferred orientation are (222).