Ball Grid Array Products Assembly Process Delamination Analysis and Improved Actions
碩士 === 國立高雄大學 === 電機工程學系碩士班 === 96 === This thesis considers the delamination behaviors between substrate and molding compound for Ball Grid Array (BGA) products caused by the plasma etching process. The water contact angle, etching rate and surface morphology analysis were used to characterize the...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/32562730095104196249 |