Mechanics Analysis and Reliability Assessment of Electronic Packages Subjected to Drops

• Main Authors: Tsung-Ying Tsai, 蔡宗穎
• Other Authors: 吳文方
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/84653344313737049555

碩士 === 國立臺灣大學 === 機械工程學研究所 === 96 === Most researchers consider the life of an electronic package subjected to drops is a fixed value. However, drop tests show that impact lives of a random sample of an electronic package usually exhibit certain scatter. Therefore, the impact life had better be described by a random variable. In this study, the influence of geometrical size variation of an electronic package on its impact life distribution and reliability is investigated. The influence of uncertainty of parametric values in the life prediction model is investigated as well. First, finite element analysis is employed to evaluate the maximum peeling stresses of solders of a random sample of an electronic package. The obtained maximum stresses are then substituted into a life prediction model to obtain the distribution of impact lives. The result shows that size variation of electronic packages does affect the life distribution and reliability estimation of the package. Next, the influence of uncertainty of parametrical values in the impact life prediction model is investigated. It is also found that uncertainty of parametrical values affects the variation of impact life and its associated reliability estimation. It is believed that the study can be used for quantitative reliability estimation of an electronic package subjected to drops.