Mechanics Analysis and Reliability Assessment of Electronic Packages Subjected to Drops

碩士 === 國立臺灣大學 === 機械工程學研究所 === 96 === Most researchers consider the life of an electronic package subjected to drops is a fixed value. However, drop tests show that impact lives of a random sample of an electronic package usually exhibit certain scatter. Therefore, the impact life had better be desc...

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Bibliographic Details
Main Authors: Tsung-Ying Tsai, 蔡宗穎
Other Authors: 吳文方
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/84653344313737049555