An Assessment of Mechanical Inter-Locking Effects on Bump/Pad Contact Surface Characteristics of a Flip Chip on Flex with Non-Conductive Adhesive
碩士 === 國立臺灣海洋大學 === 機械與機電工程學系 === 96 === This paper focuses on the mechanical interlocking effects on the bump/pad interfacial contact surface of a flip chip on flex with non-conductive adhesive under thermal cycling loads after the bonding/curing process of packaging. The aim of improvement for the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/06718483371298085574 |