Wireless Interface Design for HOY: An Emerging Test Platform

碩士 === 國立清華大學 === 電機工程學系 === 96 === Conventional testing scheme for a chip utilizes probes or sockets between Automatic Test Equipment (ATE) and Device Under Test (DUT), which will cost a lot and damage I/O pads in wafer easily. To improve the quality of chip testing, some advanced testing technolog...

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Bibliographic Details
Main Authors: Ming-Yi Chu, 朱銘億
Other Authors: Hsi-Pin Ma
Format: Others
Language:en_US
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/00355398767574467959