Reliability Assessment of Chip Size Package under Board-level Drop Test

碩士 === 國立清華大學 === 動力機械工程學系 === 96 ===

Bibliographic Details
Main Author: 洪端佑
Other Authors: 江國寧
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/57606847695811104342