Optimal Analysis of thermal Chip Placement for MultiChip Module Packaging
博士 === 國立清華大學 === 動力機械工程學系 === 96 === As the number of chips within electronic packaging increases while their feature sizes shrink, the thermal performance of multichip modules (MCMs) becomes increasingly critical. To upgrade the thermal performance of MCMs without changing package structure and ma...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/62287632159081280953 |