Interfacial reactions and microstructural evolutions of the solder joints in electronic and thermoelectric devices
博士 === 國立清華大學 === 化學工程學系 === 96 === Soldering is the most important joining technology in the electronic packaging industry. During the soldering processes, the molten solders wet and react with the substrates. Even though the soldering time is short, the substrates' interfacial reactions wit...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/86019299179576843034 |