Study on electrical mechanism of low-k material and copper interconnection under various mechanism stresses
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 96 === In order to construct the integrated circuit with high efficiency, the size of the semiconductor devices becomes smaller and smaller. The surface of the chip is unable to offer enough area for devices interconnecting, that the Ultra Large Scale Integration (...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/jg65su |