Geometric Shape Prediction for a Sn/4.0Ag/0.5Cu (SAC405) Solder Joint After Reflows
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 96 === The fatigue-induced solder joint failure of surface mounted electronic devices has become one of the most critical reliability issues in electronic packaging industry. Prediction of the shape of solder joints has drawn special attention to the related develo...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/r2ebem |