Study on Wafer-Level Packaging and Electrochemical Characterization of Planar Silver-Chloride Micro Reference Electrode

碩士 === 國立中山大學 === 電機工程學系研究所 === 96 === This thesis devotes to develop a wafer-level packaging technique of the planar AgCl-based micro reference electrode and to investigate its various electrochemical characteristics (including the potential stability and offset voltage, AC impedance, cyclic-voltam...

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Bibliographic Details
Main Authors: Chi-Chih Chu, 朱吉植
Other Authors: I-Yu Huang
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/ru9h7t