The study of CoWP/NiSi as a bilayer diffusion barrier for Copper Metallization
碩士 === 國立屏東科技大學 === 材料工程所 === 96 === In this work, the films of CoWP/NiSi as the diffusion barrier in IC copper metallization were studied. A film of Ni was first coated on Si substrate by electron beam evaporation deposition and was then annealed to form NiSi in a rapid thermal (RTA) furnace. On th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/78230463881262368166 |