The Improvement of Electrical Characteristic in Thin-GaN Light-Emitting Diodes
碩士 === 國立中央大學 === 光電科學研究所 === 96 === Chip process technology of GaN-based light-emitting diodes includes wire-bonding, flip-chip, thin-GaN, and so on. However, wire-bonding and flip-chip are inappropriate for high-power LED chips due to high thermal resistance of sapphire substrates. In this thesis,...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/37524160123571569914 |