Effects of fluxes on the electrochemical migration of reflowed Sn-3Ag-0.5Cu solders in water

• Main Authors: SHU-HUEI JAN, 詹舒卉
• Other Authors: Jing-Chie Lin
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/fr4nqu

碩士 === 國立中央大學 === 機械工程研究所碩士在職專班 === 96 === This paper relates to the effects of fluxes on the electrochemical migration of reflowed Sn-3Ag-0.5Cu solders in water. Electrochemical migration behaviors of reflowed Sn-3Ag-0.5Cu solders, so called Pb-free solders, by applying different fluxes have been studied. The electrochemical migration increasing resistance of the Sn-3Ag-0.5Cu solders at a bias of 3 or 5V with increasing Solid Content. Rosin is one of the contents of flux, and the C=O bonding of rosin is reduced after reflowing. When applying the fluxes to the solders, the C-H bonding in the surface of solders could increase the resistance of electrochemical migration. Halogen Content of the flux would change the characteristic of electrochemical migration. Halogen Content would encourage the electrochemical migrations.