Effects of fluxes on the electrochemical migration of reflowed Sn-3Ag-0.5Cu solders in water

碩士 === 國立中央大學 === 機械工程研究所碩士在職專班 === 96 === This paper relates to the effects of fluxes on the electrochemical migration of reflowed Sn-3Ag-0.5Cu solders in water. Electrochemical migration behaviors of reflowed Sn-3Ag-0.5Cu solders, so called Pb-free solders, by applying different fluxes have been s...

Full description

Bibliographic Details
Main Authors: SHU-HUEI JAN, 詹舒卉
Other Authors: Jing-Chie Lin
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/fr4nqu