The Effect of Minor Co additions on Properties of Sn-0.7Cu Lead-free Solder
碩士 === 國立交通大學 === 工學院半導體材料與製程產業專班 === 96 === In order to study the effect of the addition of Co to the Sn-0.7Cu solder, the formation of an IMC at the interface between Sn-0.7Cu-xCo(x=0, 0.05, 0.1wt%) solders and Cu Substrate were investigated, and the joint strength was also evaluated by tensile te...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/59936605829007695039 |