A Study on Semiconductor Al-Cu Process Defect and Wafer Edge Yield improvement
碩士 === 國立交通大學 === 工學院碩士在職專班半導體材料與製程設備組 === 96 === When the semi-conductor industry began changing the chip manufacturing process from aluminum to copper; it is often overlooked that the aluminum process is still more widely used. Therefore the process and performance improvement for aluminum is stil...
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| Format: | Others |
| Language: | zh-TW |
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2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/65319471961649108385 |