Assembly of Three Dimensional Microstructures on SOI Wafers Using SU-8 Mechanisms

• Main Authors: Wei Zhi Huang, 黃煒智
• Other Authors: Yi Chiu
• Format: Others
• Language: en_US
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/94368178834130857339

碩士 === 國立交通大學 === 電機與控制工程系所 === 96 === Recently, the Micro Electro Mechanical Systems (MEMS) technology has many important developments with the rapid progress in the semiconductor industry. In many applications, there is demand for three-dimensional (3-D) structures. More effective assembly technique and positioning accuracy are needed for 3-D microstructures. In this thesis, the silicon on insulator (SOI) wafers with almost zero stress are used in order to prevent the stress-induced curvature in micro devices made of poly silicon for optical applications. SU8 has good mechanical property and low temperature process, making it suitable as another structural layer and integration with circuit. In this thesis, a new assembly approach with one push operation is proposed to reduce the assembly complexity. Namely, all probe manipulation is reduced to a simple one-push operation. A novel V-shaped hinge is used to eliminate the play in traditional hinge designs and therefore improves the positioning accuracy. In order to address the issues with etch holes in surface micromachining, the structure without etch holes is used. The etching from the backside of the substrate is performed. The feasibility of the proposed one-push assembly process, V-shaped hinge elements and structure without etch holes, is verified in this thesis. The encountered problems, such as the robustness of spring structures, are discussed for further researches.