Using Dynamic Programming to Improve Overlay Control for Lithography Process

• Main Authors: Chao-Chieh Peng, 彭昭傑
• Other Authors: Chi Chiang
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/54901877725117208557

碩士 === 國立交通大學 === 管理學院碩士在職專班管理科學組 === 96 === Abstract Photo is a critical process and technology in semiconductor manufacturing and it plays a role how intelligent the IC processing, in which the quality of mask pattern will have a great direct impact on downstream processing. During lithographing process, the motion and difference will occur in mask overlapping due to different tools, different masks and a wafer itself. However, the tolerance for mask overlapping has become more critical as the dimension of metal line shrines to be narrower, the wafer size becomes bigger and the mask layers increase. The circuit may be malfunction as the tolerance in overlapping is over. Therefore, error-overlapping control to move out uncertainty and stochastic risk factors is they key for fab yield by accurately estimate parameters. Overlapping measurement that is predefined pattern for wafer accuracy to avoid breakdown in IC device is very important in Photo. In many research for industrial engineering and operation research, there are so many dispatching rules to satisfy such constraints, such as family-based dispatching rule, starvation avoidance-Glassey and Petrakian, SA, Fifo (First-in-First-Out), etc. All of them are developed to such solutions but cannot be really solve under the single tool constraints. In this paper, we propose a model that integrates actively control the single tool problem. By means of dynamic planning model on operation research and logical thinking with systematic software, such a model and system can practically solve the problem in semiconductor manufacturing.