Improvement on the Electrical Properties and Thermal Stability of BST Capacitor and High Frequency Characterization of Al/HSQ and Cu/HSQ Interconnect System for System-on-Package
博士 === 國立交通大學 === 電子工程系所 === 96 === Recently, the technology progress provides the major opportunities in both miniaturization and integration for advanced and portable electronic products, leading the community to believe that someday 3-D packaging approaches will come true, referred to as system-o...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/91384218157536522982 |