Post-Mold Cure Process Simulation of IC Packaging
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 96 === To meet customers’ demands in electronic products, all products are regarded to achieve the goals of light, small, convenient and good reliability. Epoxy molding compound (EMC) is a commonly used material in IC packaging. One of its serious defects is warpage....
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/90480987035513862298 |