Investigation of Process Characteristics in Grinding of Silicon Substrate Coated with Aluminum Thin Film

碩士 === 國立成功大學 === 機械工程學系碩博士班 === 96 === This thesis analyzes characteristics of silicon substrate coated with aluminum thin film in grinding process and an empirical formula facilitating the prediction the specific grinding energy under varying thickness of maximum undeformed chip and aluminum thin...

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Bibliographic Details
Main Authors: Kuan-Fu Chen, 陳冠甫
Other Authors: Jiunn-Jyh Wang
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/23975046814666610024