Effects of UV-Curing Time on the Thin-Film and Mechanical Properties of Porous Dielectrics
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 96 === Two materials are used to solve the RC delay issue in the multi-layer conducting line of integrated circuit (IC) devices. One is low-k dielectric material (for its low capacity), and the other is copper contact line (for its low resistitivity). However, as t...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
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2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/52135454333447071959 |