Fabrication and Package of Microfluidic Devices Using CMOS MEMS Process for Biomedical Applications

• Main Authors: Chun-ching Wu, 吳俊慶
• Other Authors: Ling-Sheng Jang
• Format: Others
• Language: en_US
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/85953021465165572620

碩士 === 國立成功大學 === 電機工程學系碩博士班 === 96 === Coming with the improvement of CMOS (complementary metal-oxide-semiconductor) technology, many researchers imply CMOS fabrication into biology field. Enhanced circuits in bioMEMS (Biological micro-electro-mechanical systems) IC (Integrated circuit) create a new research field on biology and have inconceivable potential in biosensors which can be adopted to measure multiple parameters in colonies of living cells in real time. This project proposes a design of a CMOS-based impedance sensor with MEMS structures to conduct the single cell capture and impedance measurement. This work proposes a PDMS (Polydimethylsiloxane) packages to CMOS MEMS IC design on post-MEMS encapsulation packaging process, which provides a low cost manufacturing process with the surfaces of high elastic solutions. The packaging method uses chip-to-PDMS bonding of micromachined PDMS substrates with a construction electrode, bonding of oxygen plasma, sealing pipe. The PDMS substrates are micromachined micro-channel and interconnection structures patterned on them with gold electrode and fluidic feedthroughs. The results indicate that these fabrication techniques may be useful as low cost alternatives to conventional approaches to bonding in microfludic channels of IC for micro-fluidic MEMS and biomedical applications.