Fabrication and application of polyimide plastic molds for imprinting lithography

• Main Authors: I-lin Lo, 駱易琳
• Other Authors: Lien-Chung Hsu
• Format: Others
• Language: zh-TW
• Online Access: http://ndltd.ncl.edu.tw/handle/42120721699767633980

碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 96 === Three different series of polyimide mold for nanoimprint were developed. Three kinds of polyimide precursors, poly(amic acid),were prepared from Pyromellitic dianhydride (PMDA), 4,4′-Oxydianiline (ODA), 4,4’- Hexafluoroisopropylidene diphthalic anhydride (6-FDA), 2,2-bis(3- amino-4- hydroxylphenyl)hexafluoroproane(Bis-AP-AF), and 2,2-bis (4-aminophenyl) hexafluoropropane(Bis-AAF). Subsequently, thermal cyclization of the poly(amic acid) precursors at 300 ℃ produced the correspondind polyimides. Polyimides, the glass transition temperatures and the thermal stabilities were examined by TMA and TGA, and the result demonstrated that would be suitable for the application of nanoimprint. Polyimide molds with different adhesive layers could used to imprint. Fluorinated polyimide molds were suitable for imprint because of their excellent mold-release characteristics. Solvent-free thermal initiated resist was prepared for imprint. The imprint result demonstrated that the ployimide molds and resist could be faithfully used for nanoimprint.