A Study of The Effect Bottom Antireflective Coating Etch Process on The Line Width of Contact Layer
碩士 === 國立成功大學 === 工程科學系專班 === 96 === In the integrated circuit manufacturing process, Patterns of small sizes often needs to be formed on the wafer. The method of pattern formation is to use developers to remove the exposure photo resist so that pattern can be directly transferred to wafer. Etching...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/28427769304531042171 |