Application of Taguchi Method in Thermal Analysis for the CSP BGA Packages
碩士 === 國立成功大學 === 工程科學系專班 === 96 === ABSTRACT The Chip-Scale-Package Assembly package was firstly applied to the manufacture of the memory product which possesses the advantages of small size, less material, better electrical characterization, less space occupied by the print circuit board as well a...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/77514275237927301333 |