The Study of DAF & FOW in The Use of Stacked Die Package
碩士 === 義守大學 === 材料科學與工程學系碩士班 === 96 === The trend of the electronics product is required to reduce the package size, improve the performance and advance integration. This thesis discussed that the film type die attach material mainly applied in the stacked chip scale package (SCSP). The experiment c...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/85305224044115402555 |