An Numerical study of the Wire Sweep Analysis in IC Packing by Taguchi Method
碩士 === 逢甲大學 === 機械工程學所 === 96 === This study aimed at investigating of the effect of IC packaging molding parameters on the wire sweep due to the drag force by using the numerical simulation. In numerical experiment, we used the LQFP-48 package to be the sample. The mold flow ansalysis software Mold...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/79547561493154992082 |
| Summary: | 碩士 === 逢甲大學 === 機械工程學所 === 96 === This study aimed at investigating of the effect of IC packaging molding parameters on the wire sweep due to the drag force by using the numerical simulation. In numerical experiment, we used the LQFP-48 package to be the sample. The mold flow ansalysis software Moldex3D -RIM was used to simulate the filling of IC packaging. And the structural analysis software ANSYS was used to estimate the wire sweep of package.
Taguchi analysis was employed in designing experimental parameters of IC packaging processes. The sensitivity of these controlling factors on the quality of final package was assessed in order to reach the optimum characteristics.
In the process of simulation, the largest wire sweep was observed when the direction of compounds flow is perpendicular to the gold wires. Different impacts of deflections are observed at the different design of mold geometry and process parameters. The major control factors are W/H Height, the gold wire diameter, die temperature and transformation time of forming.
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