An Numerical study of the Wire Sweep Analysis in IC Packing by Taguchi Method
碩士 === 逢甲大學 === 機械工程學所 === 96 === This study aimed at investigating of the effect of IC packaging molding parameters on the wire sweep due to the drag force by using the numerical simulation. In numerical experiment, we used the LQFP-48 package to be the sample. The mold flow ansalysis software Mold...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/79547561493154992082 |