A Study of Lean Six Sigma Applying to Process Improvement of Solder Mask Process in Printed Circuit Board Industry
碩士 === 中原大學 === 工業工程研究所 === 96 === This study develops process improvement steps which are suitable for solder mask process in printed circuit board industry. The improvement steps are based on structures, Define, Measure, Analyze, Improve, and Control from the concept of lean six sigma. To develop...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/35445388386992633590 |