Reliability analysis of wafer-level chip-scale packaging technologies for CMOS image sensor
碩士 === 中華大學 === 機械工程學系碩士班 === 96 === Abstract The objective of this thesis is to study the reliability of CMOS image sensor wafer level chip scale packages. The issues of the reliability can be categorized in two topics. One is the reliability of lead-free BGA and the other is the delamination and...
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| Format: | Others |
| Language: | zh-TW |
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2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/07302228722841444428 |