Study on the Thermal Conductivity and Application of Nanofluids
碩士 === 國立中正大學 === 機械工程所 === 96 === Lots of heat sink assemblies utilize the phenomena of boiling to dissipate heat. Water and refrigerants were commonly fluids used. Due to the development of integrated circuit fabrication, the need of the excellent dissipation device for the electronic components...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/91141639697033881129 |