A Study of Operational Parameters and Mold Insert Geometrial Devise for Micro-Electroforming
博士 === 國防大學中正理工學院 === 國防科學研究所 === 96 === In this study was taken for the simulation、neural networks and experiments of micro-electroforming on U-type holes. For a=15 μm, the copper is transported to the cathode via diffusion. For a=15 μm, the copper is transported to the cathode via convection. For...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/61367600472710307184 |