The dressing characteristics of polycrystalline diamond pad conditioner on CMP padThe dressing characteristics of polycrystalline diamond pad conditioner on CMP pad
碩士 === 國防大學中正理工學院 === 兵器系統工程研究所 === 96 === Chemical mechanical polishing (CMP) is used extensively for the global planarization of Si wafer in the semiconductor industry today. The surface quality of the wafer is often determined by the surface morphology of the dressing pad which is controlled by a...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/26052561374138634745 |