| Summary: | 碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩 === 95 === A “Bump” is a connector between Chip and Substrate in Flip Chip Assembly process. It usually is produced by Evaporating, Solder Paste Printing or Solder Plating process. In Flip Chip Bonding process, there were four important factors between the Bump and UBM (Under Bump Metallurgy) - adhesive strength, diffusion barrier effectiveness, wetting ability and IMC (Intermatllic Compounds) structure after bonding. They will influence the long term reliability result. Otherwise, we can’t ignore the defect of the Bump self. The Bump Void is the major problem of the Bump defects. It will cause excess joint resistance or crack during thermal cycle. And it usually be found in printing bumping process.
This research focuses on applying three surface handling processes for the lead free bump reflow – vacuum, flux and laser. We hope that this process can decrease or clear the bump void in order to upgrade the assembly yield and reduce reliability test fail rate. Even we can achieve the Bump Reflow process without flux using.
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